Partners

Micropac cooperates with Kyocera Corporation ( Established: 1959 – Consolidated Sales: $ 10.7 billion – Group Companies: 211 companies – Employees: 59,500- Headquarters: Kyoto, Japan) and with Kyocera America, Inc. (Part of Kyocera’s Semiconductor Components Group – Headquarters : San Diego, CA -Established in SD : 1971 -SD Employees : 500 + 80 Temps -Tijuana Employees: 750) for the distribution of innovative components, ceramics, semiconductors, electronic devices, LCD and NAD modules, optical sensors and substrates for automotive, aerospace and industrial sectors.
Specialized in Ceramic Packages, Multilayer (HTCC), LTCC , T/R modules, Assembly Technologies, piezoelectric products, converters, optical devices, HUD/ TFT display, camera modules, Communications Devices , alumina Packages, sinter glue, glow plug heater core.
Micropac offers Kyocera products to:

• OEM, TIER1 and TIER2 : HUD/ TFT display, camera modules, Communications Devices , alumina Packages, sinter glue, glow plug heater core camera module and display, connector, organic substrate, X tal, tantalum, IC package.
• AEROSPACE/MILITARY/TELECOM : Multilayer (HTCC), LTCC , T/R modules, Assembly Technologies,

Micropac cooperates with Kyocera from design to product development offering to their customers the best on the market.

(Wide Bandwidth RF Components: WiMAX, UWB -T/R Modules Increasing BW and Power- High Voltage Medical Implants- High Bandwidth Si and SiGe Devices on HiTCE Ceramic for DoD Application)

Certifications: ISO 9001 -ISO 9002 , ISO14001 – ITAR registered & compliant, DSCC / QML Class S, K certified

Micropac cooperates with Electrovac in distribution of hermetic packages for automotive, industry, energy, medical, petrol sectors.
The headquarter is located in BC-TECH HOLDING AG – Comercialstrasse 19 – 7000 Chur – Switzerland, Electrovac is also present in Germany, Austria, France, Japan and USA.

Sales by region : Europe (57%) – Asia (26%) – USA (12%) – rest of world (5%)

Specialized in automotive (64%) , Electrovac offers successfully its products also to industrial (20%), aerospace (9%) and other sectors ( 7%)

PRODUCT GROUP: Hybrid Packages – Customized Packages – Sensor Housings- Igniters – transistor header and battery covers.

Electrovac guarantees continuous improvement of all their processes and product quality

Micropac cooperates with Electrovac from design to product development offering to their customers the best on the market.

Certifications: ISO 9001:2008 – ISO TS 16949 – ISO 14001 .

Micropac cooperates with Amphenol Advanced Sensors. The company is a leading innovator in advanced sensing technologies and innovative embedded measurement solutions customized for regulatory and industry driven applications, creating value by providing critical information for real time data decisions.

Amphenol Advanced Sensors is a company of leading industry brands as Telaire, Kaye, Thermometrics, Modus Instruments, NovaSensor, and Protimeter are industry leaders over 70 years.

Amphenol Advanced Sensors offers industry leading domain expertise, rapid customization, world-class manufacturing capability and lasting customer relationships to deliver the greatest value in cost of ownership to their customers

Amphenol Advanced Sensors is a member of the USA based Amphenol Corporation. With our own global presence we offer our customers exceptional technical support and service in the areas of development, production and distribution.

Amphenol is one of the largest manufacturers of interconnect products in the world. The Company designs, manufactures and markets electrical, electronic and fiber optic connectors, coaxial and flat-ribbon cable, and interconnect systems.

The primary end markets for the Company’s products are communications and information processing markets, including cable television, cellular telephone and data communication and information processing systems; aerospace and military electronics; and automotive, rail and other transportation and industrial applications

Serma microelectronics belongs to a group (SERMA) that counts around 1.500 employees and has 30 sites within Europe Tunisia and the US. The group is involved in cyber security, energy, embedded systems and microelectronics.

SERMA Microelectronics develops and provides special processes to manufacture ceramics modules, substrates and integrate semiconductors.

Taking advantage of its strong knowledge and skills in components assembly, in ceramics, metal, and now organic material, SERMA Microelectronics helps its customers and partners in the tuning of integration processes, allowing the use of a technology on a specific mission profile.

With more than 90 employees gathered on 2 productions site in Périgny (la Rochelle) and Pinsaguel (Toulouse) counting 1000 sqm clean room, SERMA Microelectronics offers 5 main activities:

1. Engineering, that defines the right microelectronics integration processes in order to industrialize products for customers.
2. Die Management, managing the dice flows (supply, storage, wafer sawing, dies visual inspection)
3. Microelectronics production, implementing the manufacturing & test processes to produce customers goods.
4. Thick film production, defining and implementing screen-printing techniques to produce thick film substrates with high temperature resistance and service life.
5. Thin film production, using sputtering techniques at the edge of front-end technology, to implement metallic deposition of high precision (nanometric scale).

The variety of processes available within SERMA Microelectronics allows addressing various markets and technologies.

SERMA Microelectronics works on maintainability issues by maintaining robust process and securing their availability through time, and focus its R&D efforts on the development and deployment of technological bricks to integrate up-to-date technology (MEMS, High pin count devices, BGA, UBM, RDL) and mix its microelectronics means and SMT capabilities to integrate SiP (System in Package). Serma has also a special division (company founded in 1997 and acquired by Serma in 2013) that focus on mixed signal Asic development, FPGA- including migration into ASICs and obsolete circuits.