Anti vibration (absorber) tape, conductive silicon, thermal tape, conductive and cushion tape, all kinds of adhesive tape
Underfills (flip chip, COF, CSP/BGA board level, preapplied non conductive); dam and fill encapsulant; low temperature curable adhesives; B-stage adhesives;  adhesives (SMT/flip chip/die attach); electrodes pastes, low temperature metallorganic materials.

Bare ceramic substrates in various materials (Al203 various % grades, Si3N4, AlN….)
Sinter Glue – thermally conductive adhesives with pressure and pressureless dispensing, nanoparticle Ag and Cu with extremely high thermal conductivity up to 300 W/mK