Micropac cooperates with Kyocera Corporation ( Established: 1959 – Consolidated Sales: $ 10.7 billion – Group Companies: 211 companies – Employees: 59,500- Headquarters: Kyoto, Japan) and with Kyocera America, Inc. (Part of Kyocera’s Semiconductor Components Group – Headquarters : San Diego, CA -Established in SD : 1971 -SD Employees : 500 + 80 Temps -Tijuana Employees: 750) for the distribution of innovative components, ceramics, semiconductors, electronic devices, LCD and NAD modules, optical sensors and substrates for automotive, aerospace and industrial sectors.
Specialized in Ceramic Packages, Multilayer (HTCC), LTCC , T/R modules, Assembly Technologies, piezoelectric products, converters, optical devices, HUD/ TFT display, camera modules, Communications Devices , alumina Packages, sinter glue, glow plug heater core.
Micropac offers Kyocera products to:
- OEM, TIER1 and TIER2 : HUD/ TFT display, camera modules, Communications Devices , alumina Packages, sinter glue, glow plug heater core camera module and display, connector, organic substrate, X tal, tantalum, IC package.
- AEROSPACE/MILITARY/TELECOM : Multilayer (HTCC), LTCC , T/R modules, Assembly Technologies,
Micropac cooperates with Kyocera from design to product development offering to their customers the best on the market.
(Wide Bandwidth RF Components: WiMAX, UWB -T/R Modules Increasing BW and Power- High Voltage Medical Implants- High Bandwidth Si and SiGe Devices on HiTCE Ceramic for DoD Application)
Certifications: ISO 9001 -ISO 9002 , ISO14001 – ITAR registered & compliant, DSCC / QML Class S, K certified
Micropac cooperates with Electrovac in distribution of hermetic packages for automotive, industry, energy, medical, petrol sectors.
The headquarter is located in BC-TECH HOLDING AG – Comercialstrasse 19 – 7000 Chur – Switzerland, Electrovac is also present in Germany, Austria, France, Japan and USA.
Sales by region : Europe (57%) – Asia (26%) – USA (12%) – rest of world (5%)
Specialized in automotive (64%) , Electrovac offers successfully its products also to industrial (20%), aerospace (9%) and other sectors ( 7%)
PRODUCT GROUP: Hybrid Packages – Customized Packages – Sensor Housings- Igniters – transistor header and battery covers.
Electrovac guarantees continuous improvement of all their processes and product quality
Micropac cooperates with Electrovac from design to product development offering to their customers the best on the market.
Certifications: ISO 9001:2008 – ISO TS 16949 – ISO 14001 .
Micropac cooperates with Amphenol Advanced Sensors. The company is a leading innovator in advanced sensing technologies and innovative embedded measurement solutions customized for regulatory and industry driven applications, creating value by providing critical information for real time data decisions.
Amphenol Advanced Sensors is a company of leading industry brands as Telaire, Kaye, Thermometrics, Modus Instruments, NovaSensor, and Protimeter are industry leaders over 70 years.
Amphenol Advanced Sensors offers industry leading domain expertise, rapid customization, world-class manufacturing capability and lasting customer relationships to deliver the greatest value in cost of ownership to their customers
Amphenol Advanced Sensors is a member of the USA based Amphenol Corporation. With our own global presence we offer our customers exceptional technical support and service in the areas of development, production and distribution.
Amphenol is one of the largest manufacturers of interconnect products in the world. The Company designs, manufactures and markets electrical, electronic and fiber optic connectors, coaxial and flat-ribbon cable, and interconnect systems.
The primary end markets for the Company’s products are communications and information processing markets, including cable television, cellular telephone and data communication and information processing systems; aerospace and military electronics; and automotive, rail and other transportation and industrial applications
Automotive business unit of Compal (infotainment modules)
Compal is a huge company in terms of size (30 billions $ turnover in 2015) established in 1984
It has been originally structured to work as a subcontractor for companies such as
Dell, Apple, Acer, Asus… in order to manufacture pc, laptops, smartphones , TV…
About 80.000 people are working in Compal with engineers accounting for more than 10% of the workforce.
The Automotive Division was founded in 2000 and is smaller in size (only 500 people) . Yet it can exploit the structures and the competences of the mother company. The basic concept comes from the fact that the car has been becoming more and more connected to the Internet and requesting computer functions. The Compal know how in terms of software and hardware were easily transferrable into the automotive infotainment sector
The main advantages come from the fact that Compal has almost unlimited possibilities to design, industrialize and manufacture, according to the customer’s needs. It can then either supply a specific portion of the infotainment unit (such as a mother board, or a RX/TX module) or the complete system to be just plugged in. Consequently Compal can either supply tier 1 or 2 or automotive OEM and be, from time to time, pure subcontractors or designers.
A further advantage can come sometimes from the fact that Compal buys huge volumes of components/materials and hence in the BOM the customer can find it convenient to have Compal procure such products (i.e. displays, capacitors….)
Compal is certified in every possible way and has factories and R&D centre in several areas worldwide.
Japanese corporation established in 1946 specialized in technical materials for the assembly, coverage, insulation and attachment of circuits and pcbs.
The applications fields are many and differentiated (from automotive to LED lighting, from smart phones to TVs, from solar modules to computers).
Whenever there is a need for performing insulating or conductive materials, Namics can offer a solution.
Namics has grown exponentially over the years and, regarding the relationship with Micropac, it is due to the aquisition of Diemat (2008) company that had already been collaborating with Micropac for years.
New Namics production plant and offices are present at a worldwide level.
The products offer is structured in the following way:
Chipcoat: underfills per 2,5D e 3D, Copper Pillar, NCP e NCF
Unimec: thermally conductive die attach adhesives
– Passive components terminal electrode pastes
– Low temperature solar electrode pastes
Himec: passive components terminal/internal electrode pastes
– Solar cell front & backside electrode
Ohmcoat: chip resistor protective coatings
Adflema: pre-applied insulating thin film adhesives
– Insulating high thermally conductive films
Torrey distributes at a worldwide level the furnaces manufactured by Ecrim (Eastern China Research Institute for Microelectronics) with the Eletek-Hengli brand. Furnaces sales (Eletek-Hengli) in 2011 reached 50 milions dollars and the employees are just about 1.000 The furnaces are ISO9001:2000 certified and carry the CE approval. The Eletek-Hengli furnaces have been installed all over the world and, regarding Europe, in Israel, Italy, Russia, Slovenia and Switzerland. Installation and post sales services are guaranteed by Torrey and Micropac. Costs (on the average -40%), delivery time (5weeks) and service had Torrey selling over 100 units per year in the last 5 years.